Plasma Etching


Oxford Instruments Plasmalab System 100 ICP-RIE

Oxford Instruments Plasmalab System 100 ICP-RIE

The Oxford Inductively-Coupled Plasma Reactive Ion Etch system is currently configured to etch a wide range of materials with anisotropic features. Current process gasses available are:

  • Sulfur hexafluoride
  • Octafluorocyclobutane
  • Argon
  • Oxygen
  • Methane
  • Hydrogen

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