West Bond 7KF Wire Bonder
The West Bond 7KF is a low frequency (63 kHz) wedge and ball bonding machine. Bond power (0-2.5 W), time (1-1000 ms), force (15-130 g), and tool heat (40-240 °C), as well as other parameters, are all programmatically controlled. 21 Memory slots are available to save optimized bond parameters.
45° and 90° (deep access) wedge bonding and ball bonding tool heads are available.
A Heated (up to 250 °C) stage and a non-heated work holder for chip carriers are both available.
25 µm gold wire is available for wedge and ball bonding. 33 µm aluminum wire is available for wedge bonding. Ribbon bonding is not currently available.