Services
Services and usage of the facility are available to researchers from all public and private research institutions. Training is provided to new users in the use of micro- and nanofabrication procedures and equipment. Hourly and per-use rates apply for facility access, equipment usage, and staff labor. Consultation is free.
Facility Capabilities
Briefly, the microfabrication facility cleanroom suite consists of:
- Class 6 Gowning Vestibule
- Class 5 Photolithography Bay with a UV flood source and mask aligner, a spin coater, three 10" hot plates, an HMDS vacuum oven, gravity oven
- Class 5 Bay with a Nano-Imprint Lithography system, micro-pattern generator (mask writer), Atomic-Force Microscope, and 3D profiling digital microscope
- Class 6 Deposition Bay with an electron beam evaporator, DC magnetron sputterer, 3D optical profilometer, probe station, oxygen plasma reactor, sputter coater, and a camera-equipped microscope
- Class 6 Plasma tool bay for Inductively-Coupled Plasma Reactive Ion Etching (ICP-RIE), Plasma-Enhanced Chemical Vapor Deposition (PECVD), and plasma ashing
- Class 7 Wet Lab with dedicated acid, base and HF fume hoods, chemical storage, ultrapure water, and stylus profilometer
- Class 7 PDMS station with gravity oven, oxygen plasma reactor, PVD chamber, alignment tool, port punch tool and microscopes
- Class 7 Device Assembly room with hot embossers, CO2 laser engraver, muffle and tube furnaces, and a camera-equipped microscope
- Class 7 Metrology room with an SEM, ellipsometer, stylus profilometer and tensiometer
- Class 7 Post-process (backend) workspace with a wafer dicer, wafer tape machine, wire bonder and probe station
- Class 7 open lab space for users to prepare devices and materials, and run assays
- Class 8 workspace with 3D printers (stereolithographic and extruded filament) polisher/grinder, glass drilling station, and a solder station
