Services
Services and usage of the facility are available to researchers from all public and private research institutions. Training is provided to new users in the use of micro- and nanofabrication processes and equipment. Hourly and per-use rates apply for facility access, equipment usage, and staff labor. Consultation is free.
Facility Capabilities
Briefly, the microfabrication facility cleanroom suite consists of:
- Class 6 Gowning Vestibule: with storage for 72 users
- Class 5 Photolithography Bay: UV flood source and mask aligner; spin coater: three 10" bake plates; HMDS vapor prime oven; and gravity oven
- Class 5 Nanopatterning Bay: nano-imprint lithography system; laser micro-pattern generator (mask writer); AFM with lithography mode; and beam pen lithography system
- Class 6 Deposition Bay: E-beam evaporator; DC magnetron sputterer; 3D optical (WLI) profilometer; and oxygen plasma reactor
- Class 6 Plasma Tool Bay: Inductively-Coupled Plasma Reactive Ion Etcher (ICP-RIE); Plasma-Enhanced Chemical Vapor Deposition (PECVD), and plasma asher
- Class 7 Wet Lab: Three laminar flow workstations for acid chemistries, base chemistries, and hydrofluoric acid; ultrapure (ASTM Type I) water supply; and stylus profilometer
- Class 7 PDMS Workspace: degassing chamber; gravity oven; oxygen plasma reactor; PVD vacuum chamber; alignment tool; and port punch tool
- Class 7 Device Assembly Room: two hot embossers; CO2 laser engraver; muffle and tube furnaces
- Class 7 Metrology Room: variable pressure SEM; spectroscopic ellipsometer; stylus profilometer; and tensiometer
- Class 7 Post-process (back-end) Room: wafer dicer; wafer tape machine; wire bonder; and probe station with four probes, oscilloscope, DMM, precision source, and function generator
- Class 7 Open Lab Room: for users to prepare devices and materials, and/or to run assays in a cleanroom environment
- Gray workspace: stereolithographic 3D printer; extruded filament 3D printer; and glass drilling station
