Disco DAD3221 Dicing Saw
The Disco DAD3221 Automatic Dicing Saw is used to cut wafers and glass substrates up to 6” in diameter. It is equipped with a 2 kW 40,000 r/m spindle that holds hubless blades. The dicer has a Y-axis indexing precision of 1 µm (Pitch error of 5 µm), and X-axis positioning precision of 1 mm, with a maximum feed speed of 800 mm/sec. The total vertical stroke is 32.2 mm, with 1 µm indexing precision. The maximum rotational range is 90°, with 0.08° steps.